4Industry information

Why do I need SPI with AOI full inspection?


(1) According to statistics, the introduction of SPI can effectively reduce the unqualified rate of the original finished PCB by more than 85%; the cost of repair and scrapping is greatly reduced by more than 90%, and the quality of the manufactured products is significantly improved.

(2) The combination of SPI and AOI, through real-time feedback and optimization of the SMT production line, can make the production quality more stable, and greatly shorten the unstable trial production stage that must be experienced when the new product is introduced, and the corresponding cost is more economical.

(3) It can greatly reduce the misjudgment rate of AOI on solder, thereby improving the straight-through rate and effectively saving manpower and time cost for human error correction. According to statistics, 74% of the unqualified parts of the current finished PCB are directly related to solder, and 13% have an indirect relationship. SPI effectively compensates for the shortcomings of traditional detection methods through 3D detection methods.

(4) Some components on the PCB, such as BGA, CSP, PLCC chips, etc., due to the occlusion of light caused by their own characteristics, the AOI cannot detect the patch after reflow. The SPI is controlled by the process to minimize the disadvantages of these devices after the furnace.

(5) With the increasing precision of electronic products and the trend of lead-free soldering, patch components are becoming more and more miniature. Therefore, the quality of solder paste printing is becoming more and more important. SPI can effectively ensure good solder paste printing quality and significantly reduce the possibility of defective finished products.

(6) As a means of product quality process control, quality hazards can be found in time before reflow soldering, so there is almost no possibility of repair cost and scrapping, which effectively saves costs.

The light is blocked by sex, and the AOI cannot detect it after the patch is reflowed. The SPI is controlled by the process to minimize the disadvantages of these devices after the furnace.

(5) With the increasing precision of electronic products and the trend of lead-free soldering, patch components are becoming more and more miniature. Therefore, the quality of solder paste printing is becoming more and more important. SPI can effectively ensure good solder paste printing quality and significantly reduce the possibility of defective finished products.

(6) As a means of product quality process control, quality hazards can be found in time before reflow soldering, so there is almost no possibility of repair cost and scrapping, which effectively saves costs.

There are forced hot air convection, electric heating plate convection, electric heating rod heating and infrared heating. Among these methods, forced heat convection is generally considered to be the most efficient heat transfer method for wave soldering machines in most processes. After preheating, the board is soldered with a single wave (λ wave) or a double wave (spoiler wave and lambda wave). For a perforated component, a single wave is sufficient. When the board enters the wave, the direction of solder flow is opposite to the direction of travel of the board, creating eddy currents around the component leads. This is like a washing machine that removes all of the flux and oxide film residues above and forms a wetting when the solder joint reaches the wetting temperature.

For hybrid technology assemblies, spoiler waves are also typically used before the lambda wave. This wave is narrower and has a higher vertical pressure during the disturbance, allowing the solder to penetrate well between the pin and the surface mount component (SMD) pad, and then forming the solder joint with a lambda wave. . Before making any assessments of future equipment and suppliers, it is necessary to determine all the specifications of the board to be soldered with the peaks, as these can determine the performance of the required machine.

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